Patent Assignment
Reel/Frame 059516/0599
Assignment of Assignor's Interest
Recorded: 2022-04-06
Pages: 4
Assignors
HSU, CHIA-KUEI
Executed: 2022-04-05
YEW, MING-CHIH
Executed: 2022-03-29
LIAO, LI-LING
Executed: 2022-04-01
LIN, PO-YAO
Executed: 2022-03-29
JENG, SHIN-PUU
Executed: 2022-03-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Chip Package Structure Including an Underfill Material Portion Comprising a Cut Region