Patent Assignment
Reel/Frame 059521/0876
Assignment of Assignor's Interest
Recorded: 2022-04-06
Pages: 6
Assignors
EID, FERAS
Executed: 2017-10-19
PADMANABHAN RAMALEKSHMI THANU, DINESH
Executed: 2017-10-19
CHAN ARGUEDAS, SERGIO
Executed: 2017-10-19
SWAN, JOHANNA M.
Executed: 2017-10-19
BEATTY, JOHN J.
Executed: 2017-10-23
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Substrate Integrated Posts and Heat Spreader Customization for Enhanced Package Thermomechanics