Patent Assignment
Reel/Frame 059532/0832
Assignment of Assignor's Interest
Recorded: 2022-04-07
Pages: 5
Assignors
YIM, CHOONGBIN
Executed: 2022-03-01
SHIM, JONGBO
Executed: 2022-03-02
KIM, JIHWANG
Executed: 2022-03-02
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including a Lower Substrate and an Upper Substrate
Application:
17/715,417 →
Publication:
US 2023/0021867