Assignment of Assignor's Interest

Recorded: 2022-03-30 Pages: 12

Assignors

RYU, SEUNGMIN

Executed: 2022-02-05

KIM, YOUNSOO

Executed: 2022-02-25

KIM, JAEWOON

Executed: 2022-02-05

HARANO, KAZUKI

Executed: 2022-01-31

SAITO, KAZUYA

Executed: 2022-02-02

KOIDE, TAKANORI

Executed: 2022-02-01

AOKI, YUTARO

Executed: 2022-01-18

PARK, GYUHEE

Executed: 2022-02-14

CHO, YOUNJOUNG

Executed: 2022-02-05

FUSE, WAKANA

Executed: 2022-02-01

MANABE, YOSHIKI

Executed: 2022-01-18

UCHIUZOU, HIROYUKI

Executed: 2022-02-01

KIMURA, MASAYUKI

Executed: 2022-02-01

YOSHII, TAKAHIRO

Executed: 2022-02-01

Assignees

SAMSUNG ELECTRONICS CO., LTD.

129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF

ADEKA CORPORATION

2-35, HIGASHIOGU 7-CHOME, ARAKAWA-KU, TOKYO, JAPAN

Covered Property (1)

Organometallic Adduct Compound and Method of Manufacturing Integrated Circuit Device by Using the Same

Application: 17/708,323 →

Publication: US 2022/0324887