Patent Assignment
Reel/Frame 059566/0487
Assignment of Assignor's Interest
Recorded: 2022-04-12
Pages: 4
Assignors
LU, CHUN-LIN
Executed: 2022-03-28
CHANG, SHOU-ZEN
Executed: 2022-03-28
CHU, YING-TSUNG
Executed: 2022-03-28
TSAI, MING-HSUN
Executed: 2022-03-28
Assignee
POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
NO. 18, LI-HSIN RD. 1, HSINCHU SCIENCE PARK,, HSINCHU, TAIWAN
Covered Property
(1)
Wafer Structure Including Probe Marked Test Pads