Patent Assignment
Reel/Frame 059572/0587
Assignment of Assignor's Interest
Recorded: 2022-04-12
Pages: 7
Assignors
CHANG, JONGHYEON
Executed: 2022-02-03
KIM, HYUNAH
Executed: 2022-02-08
YOU, YOUNGHYUN
Executed: 2022-02-08
JIN, YOUNGHWAN
Executed: 2022-02-08
CHOI, JUNHO
Executed: 2022-02-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Debonding Apparatus