Patent Assignment
Reel/Frame 059577/0618
Assignment of Assignor's Interest
Recorded: 2022-04-12
Pages: 4
Assignors
LIN, TA-CHUN
Executed: 2022-04-05
CHEN, MING-CHE
Executed: 2022-04-01
LIN, CHUN-JUN
Executed: 2022-04-05
PAN, KUO-HUA
Executed: 2022-04-01
LIAW, JHON-JHY
Executed: 2022-04-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Structure and Method for Forming the Same