IP Library Assignment 059590/0677
Patent Assignment
Reel/Frame 059590/0677

Assignment of Assignor's Interest

Recorded: 2022-04-13 Pages: 4
Assignors
LIN, FAN-CHENG
Executed: 2022-04-07
HSIAO, PO-KAI
Executed: 2022-04-07
HUANG, TSAI-YU
Executed: 2022-04-07
CHANG, HUICHENG
Executed: 2022-04-10
YEO, YEE-CHIA
Executed: 2022-04-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Method for Forming Semiconductor Device with Monoclinic Crystalline Metal Oxide Capping Layer
Application: 17/719,040 →
Publication: US 2023/0326788