Patent Assignment
Reel/Frame 059601/0172
Assignment of Assignor's Interest
Recorded: 2022-04-14
Pages: 5
Assignors
BAEK, SEUNG DAE
Executed: 2022-03-29
KIM, SUNG YUP
Executed: 2022-03-29
PARK, JUN GOO
Executed: 2022-03-29
Assignee
ZEUS CO., LTD.
132, ANNYEONGNAM-RO,, HWASEONG-SI, GYEONGGI-DO, 18363, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Processing Apparatus and Wafer Processing Method