Patent Assignment
Reel/Frame 059602/0716
Assignment of Assignor's Interest
Recorded: 2022-04-14
Pages: 3
Assignors
WANG, WEI-REN
Executed: 2022-04-10
LEE, TZE-LIANG
Executed: 2022-04-09
WANG, JEN HUNG
Executed: 2022-04-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnect Structure and Method of Forming the Same