Patent Assignment
Reel/Frame 059617/0357
Assignment of Assignor's Interest
Recorded: 2022-04-17
Pages: 5
Assignors
CHAINER, TIMOTHY J.
Executed: 2022-04-05
SCHULTZ, MARK D.
Executed: 2022-04-05
BUDD, RUSSELL A.
Executed: 2021-12-22
TAKKEN, TODD EDWARD
Executed: 2021-12-22
DOYLE, MATTHEW
Executed: 2022-04-06
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Wafer to Wafer High Density Interconnects
Application:
17/564,170 →
Publication:
US 2023/0207523