Patent Assignment
Reel/Frame 059625/0933
Assignment of Assignor's Interest
Recorded: 2022-04-18
Pages: 8
Assignors
CHOI, JINHYUK
Executed: 2022-02-09
SONG, MYUNGKI
Executed: 2022-02-14
LEE, KONGWOO
Executed: 2022-02-09
LEE, KYUSANG
Executed: 2022-02-14
HWANG, BEOMSOO
Executed: 2022-02-09
KIM, KEONWOO
Executed: 2022-02-10
SEO, JONGHWI
Executed: 2022-03-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Processing Apparatus Including Efem and Method of Processing Wafer