Patent Assignment
Reel/Frame 059628/0427
Assignment of Assignor's Interest
Recorded: 2022-04-18
Pages: 5
Assignors
CHIEN, TING-JUNG
Executed: 2022-04-12
KUO, JIUN-MING
Executed: 2022-01-18
FU, SHIH-HAO
Executed: 2022-02-06
PENG, YUAN-CHING
Executed: 2022-01-18
LIN, YEN-PO
Executed: 2022-01-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Structure and Method for Fabricating the Same