Patent Assignment
Reel/Frame 059633/0724
Assignment of Assignor's Interest
Recorded: 2022-04-19
Pages: 4
Assignors
TSAI, SHANG-LUN
Executed: 2022-03-10
CHEN, SHUO-MAO
Executed: 2022-03-10
LIU, MONSEN
Executed: 2022-03-10
LAI, PO-YING
Executed: 2022-04-18
JENG, SHIN-PUU
Executed: 2022-03-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Interposer via Interconnect Shapes with Improved Performance Characteristics and Methods of Forming the Same
Application:
17/723,622 →
Publication:
US 2022/0406723