Patent Assignment
Reel/Frame 059635/0543
Assignment of Assignor's Interest
Recorded: 2022-04-19
Pages: 4
Assignor
AHN, SEOK GEUN
Executed: 2022-03-29
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same