Patent Assignment
Reel/Frame 059661/0876
Assignment of Assignor's Interest
Recorded: 2022-04-21
Pages: 5
Assignors
LEE, HYEONSEOK
Executed: 2022-03-22
KIM, JONGYOUN
Executed: 2022-03-22
LEE, SEOKHYUN
Executed: 2022-03-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package