Patent Assignment
Reel/Frame 059662/0140
Assignment of Assignor's Interest
Recorded: 2022-04-21
Pages: 3
Assignors
LEE, HOSOON
Executed: 2022-04-14
LEE, WONSUN
Executed: 2022-04-14
CHOI, HYUNSUK
Executed: 2022-04-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Including Back Surface Plate and Manufacturing Method of Back Surface Plate