IP Library › Assignment 059666/0359
Patent Assignment
Reel/Frame 059666/0359

Assignment of Assignor's Interest

Recorded: 2022-04-21 Pages: 4
Assignors
XIA, WUXING
Executed: 2022-04-21
JIN, YE
Executed: 2022-04-21
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Semiconductor Device Including Bonding Covers
Application: 17/660,076 →
Publication: US 2023/0343739
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 4, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 061071/0525 →
Release of Security Interest in Patents, Recorded at Reel 061071, Frame 052 Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, AS GRANTOR; ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC., AS GRANTOR
Reel/Frame 064067/0654 →