Patent Assignment
Reel/Frame 064067/0654
Release of Security Interest in Patents, Recorded at Reel 061071, Frame 052
Recorded: 2023-06-22
Pages: 9
Assignor
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Executed: 2023-06-22
Assignees
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, AS GRANTOR
5005 EAST MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC., AS GRANTOR
5005 EAST MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Properties
(75)
Crossover Point Correction of Differential Signal
Rotor for Inductive Slip, Eccentricity, and Tilt Sensing
Harmonic Distortion Reduction in Inductive Position Sensors
Battery Hazard Detection
Multi-Faced Molded Semiconductor Package and Related Methods
Thermal Performance Improvement and Stress Reduction in Semiconductor Device Modules
Optical Systems with Tiltable Filters
Application:
17/658,153 →
Publication:
US 2023/0324671
Oxidation and Corrosion Prevention in Semiconductor Devices and Semiconductor Device Assemblies
Hybrid Inductor Current Monitoring for Power Switch
Backside Ohmic Contacts for Semiconductor Devices
Clip Design and Method of Controlling Clip Position
Flexible Clip with Aligner Structure
Backmetal Removal Methods
Output Overvoltage Protection for a Totem Pole Power Factor Correction Circuit
Image Sensors Having Dielectric Relaxation Correction Circuitry
Thermal Mismatch Reduction in Semiconductor Device Modules
Singulation of Silicon Carbide Semiconductor Wafers
Semiconductor Package and Related Methods
Image Sensor Package
Semiconductor Devices and Methods of Manufacturing Semiconductor Devices
Semiconductor Device Including Bonding Covers
Semiconductor Package System and Related Methods
Semiconductor Packages with Die Including Cavities
High Dynamic Range Imaging Pixels with Multiple Photodiodes
Electronic Device Including a Transistor and a Shield Electrode
Expanded Image Sensor Pixel Array
Reinforced Semiconductor Die and Related Methods
Method and System of a Power Converter with Secondary Side Active Clamp
Multi-Chip System-In-Package
Semiconductor Device and Method for Supporting Ultra-Thin Semiconductor Die
Semiconductor Devices and Methods of Manufacturing Semiconductor Devices
Semiconductor Package Electrical Contacts and Related Methods
Configurable Low Ohmic Power Circuits
Image Sensors with Hybrid Analog-to-Digital Converter Architecture
Low-Noise Amplifier (Lna) with High Power Supply Rejection Ratio (Psrr)
Process of Forming an Electronic Device Including a Polymer Support Layer
Image Sensor Packaging Structures and Related Methods
Image Sensor Packaging Structures and Related Methods
Application:
17/664,138 →
Publication:
US 2023/0395633
Flexible Distributed Antenna Array
Driver for Mitigating High-Voltage Surges at Host and Sink Interface Devices
Patent:
11,764,783 →
Application:
17/664,277 →
Immersion Cooling Package
Application:
17/664,482 →
Publication:
US 2022/0406683
Optoelectronic Device Having a Modular Package
Immersion Direct Cooling Modules
Submodule Semiconductor Package
Drive Methods for a Three-Phase Motor
Steering Matrix Derivation
Error Correction Overwrite for Audio Artifact Reduction
Application:
17/739,908 →
Publication:
US 2023/0055690
Transmission Error Robust Adpcm Compressor with Enhanced Response
Early Link Detection Based Adaptive Selection of Receive Parameters
System and Methods for Switching an Active Clamp Flyback Converter
Power Modules and Related Methods
Application:
17/804,423 →
Publication:
US 2022/0293499
Epitaxial Field Stop Region for Semiconductor Devices
Application:
17/804,460 →
Publication:
US 2023/0049926
Interference Filter and Electrostatic Discharge / Electrical Surge Protection Circuit and Device
Multiphase Trans-Inductor Voltage Regulator Fault Diagnostic
Offset Cancel Systems and Methods for Resolver-Type Sensors
Structures and Methods for Source-Down Vertical Semiconductor Device
Diodes Including Multiple Schottky Contacts
Application:
17/805,824 →
Publication:
US 2023/0395730
Wide Voltage Range Input and Output Circuits
Silicon-On-Insulator Die Support Structures and Related Methods
Low Power Oscillator with Variable Duty Cycle and Method Therefor
Integrated Transistor and Resistor-Diode-Capacitor Snubber
Fault Protection Testing in a High-Power Switching System
Dual Side Direct Cooling Semiconductor Package
Wide Input Voltage Range Low-Power Charge Pump Based Ldo
Beamformer Solicited Sounding
Power Module
Semiconductor Package Electrical Contact Structures and Related Methods
Substrate Alignment Systems and Related Methods
Gate Driver with Temperature Monitoring Features
Multichannel Minimum Distance Chirp Echo Detection
Shielded Gate Accumulation Fet with a T-Shaped Mesa
Application:
63/362,418 →
Transfer Molded Power Module
Application:
63/362,638 →
Power Module
Application:
63/364,166 →
Edge Seals for Semiconductor Devices
Application:
63/364,400 →
Integrated Rtc Snubber to Reduce Overvoltage in Smart Power Stages
Application:
63/366,198 →
Related Assignments
(22)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 1, 2022
From: KHAN P, ATHAR ALI; GANESH, SARAVANAN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 059470/0543 →
Assignment of Assignor's Interest
Apr 4, 2022
From: BERTIN, JACQUES JEAN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 059486/0503 →
Assignment of Assignor's Interest
Apr 4, 2022
From: BERTIN, JACQUES JEAN
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 059487/0185 →
Assignment of Assignor's Interest
Apr 5, 2022
From: KONDO, HIDEO
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 059503/0811 →
Assignment of Assignor's Interest
Apr 5, 2022
From: KUROSE, EIJI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 059508/0708 →
Assignment of Assignor's Interest
Apr 6, 2022
From: JASINSKI, DAVID WAYNE
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 059518/0475 →
Assignment of Assignor's Interest
Apr 6, 2022
From: LIU, YONG; YANG, QING
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 059514/0786 →
Assignment of Assignor's Interest
Apr 7, 2022
From: HASAN, MAHBUB
To: FAIRCHILD SEMICONDUCTOR, LLC
Reel/Frame 059535/0573 →
Assignment of Assignor's Interest
Apr 7, 2022
From: YEDURU, SRINIVASA REDDY; CHANG, GEORGE
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 059532/0081 →
Assignment of Assignor's Interest
Apr 12, 2022
From: PRAJUCKAMOL, ATAPOL; CHEW, CHEE HIONG; NG, VEMMOND JENG HUNG
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 059573/0026 →
Assignment of Assignor's Interest
Apr 13, 2022
From: SEDDON, MICHAEL J.; CARNEY, FRANCIS J.; CHEW, CHEE HIONG; WANG, SOON WEI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 059585/0493 →
Assignment of Assignor's Interest
Apr 14, 2022
From: MESA, ARMANDO GABRIEL; HARI, AJAY KARTHIK
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 059601/0664 →
Assignment of Assignor's Interest
Apr 14, 2022
From: LLOYD, DENVER; INNOCENT, MANUEL H.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 059604/0419 →
Assignment of Assignor's Interest
Apr 15, 2022
From: IM, SEUNGWON; JEON, OSEOB
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 059608/0844 →
Assignment of Assignor's Interest
Apr 18, 2022
From: YEDURU, SRINIVASA REDDY; GANAGONA, NAVEEN; CHANG, GEORGE; PARK, BYOUNGYONG
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 059622/0645 →
Assignment of Assignor's Interest
May 11, 2022
From: LIN, YUSHENG; NOMA, TAKASHI
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 059889/0536 →
Assignment of Assignor's Interest
May 12, 2022
From: LEE, KEUNHYUK; TEYSSEYRE, JEROME; MALDO, TIBURCIO A.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 059969/0651 →
Security Interest
Aug 4, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 061071/0525 →
Assignment of Assignor's Interest
Oct 18, 2022
From: FAIRCHILD SEMICONDUCTOR, LLC
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 061455/0613 →
Employment Agreement
Oct 18, 2022
From: TANG, YUE HUNG
To: FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 062377/0534 →
Change of Name
Oct 18, 2022
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: FAIRCHILD SEMICONDUCTOR, LLC
Reel/Frame 061701/0403 →
Security Interest
Jul 13, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; GTAT CORPORATION
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064271/0971 →