Flexible clip with aligner structure

1. A clip preform comprising:

a die contact portion having a planar surface configured to contact a surface of a semiconductor die, the die contact portion being disposed at a first distal end of the clip preform;

an aligner structure including a lead contact portion having a planar surface, the aligner structure configured to attach the lead contact portion to a lead post, the aligner structure being disposed at an opposite second distal end of the clip preform; and

an intermediate portion connecting the die contact portion to the lead contact portion in the aligner structure,

the die contact portion, the intermediate portion, and the aligner structure of the clip preform forming a structure of a primary clip for connecting the semiconductor die to the lead post,

the clip preform being severable by removing a part of the die contact portion and a part of the intermediate portion of the clip preform to form a secondary clip for connecting the semiconductor die to the lead post,

the aligner structure, a remaining part of the die contact portion, and a remaining part of the intermediate portion of the clip preform forming a structure of the secondary clip.

2. The clip preform of claim 1 , wherein the die contact portion in the primary clip has a lateral width perpendicular to a longitudinal axis extending from the first distal end in a direction of the second distal end, and wherein the remaining part of die contact portion in the secondary clip has a smaller lateral width than the lateral width of the die contact portion in the primary clip.

3. The clip preform of claim 1 , wherein the aligner structure in the secondary clip to attach the lead contact portion to the lead post has a same structure as the aligner structure in the primary clip.

4. The clip preform of claim 1 , wherein the die contact portion, the intermediate portion, and the aligner structure include a stamped sheet of metal.

5. The clip preform of claim 1 , further comprising, a singulation guide or marking on the primary clip identifying the part of the die contact portion and the part of the intermediate portion to be removed from the primary clip to form the secondary clip.

6. The clip preform of claim 5 wherein the singulation guide or marking includes at least a slot formed along an edge of the part of the die contact portion and or the part of the intermediate portion to be removed from the primary clip to form the secondary clip.

7. The clip preform of claim 5 , wherein the singulation guide or marking includes a guide notch disposed on an edge of the lead contact portion, the guide notch configured to guide a cutting or singulation tool to cut the primary clip along a line perpendicular to the edge.

8. The clip preform of claim 1 , wherein a major planar surface of the die contact portion is downset from a major planar surface of the lead contact portion by a distance perpendicular to the major planar surfaces.

9. The clip preform of claim 1 , wherein the aligner structure includes vertical walls extending from lateral edges of the lead contact portion, the walls and the lead contact portion forming a cavity configured to hold the lead post.

10. A primary clip comprising:

an aligner structure configured to attach a lead contact portion to a lead post;

a die contact portion configured to contact a surface of a semiconductor die;

the die contact portion having a surface downset from a surface of the lead contact portion, the die contact portion having a first lateral width; and

an intermediate portion connecting the die contact portion to the lead contact portion in the aligner structure,

the primary clip including at least a secondary clip formed by removal of a part of the die contact portion, the die contact portion remaining in the secondary clip having a second lateral width that is smaller than the first lateral width.

11. The primary clip of claim 10 , wherein the lead contact portion, the die contact portion, and the intermediate portion comprise a stamped sheet of metal.

12. The primary clip of claim 10 , wherein the secondary clip is severable from the primary clip along a longitudinal line extending from a lateral edge of the die contact portion through the intermediate portion toward the lead contact portion and a lateral line through a bottom portion of the lead contact portion.

13. The primary clip of claim 10 , further comprising, a singulation guide or marking on a surface of the primary clip identifying the part of the die contact portion and the part of the intermediate portion to be removed from the primary clip to form the secondary clip.

14. The primary clip of claim 13 , wherein the singulation guide or marking includes a longitudinal slot aligned with a longitudinal edge of the part of the die contact portion and the part of the intermediate portion to be removed from the primary clip to form the secondary clip.

15. The primary clip of claim 13 , wherein the singulation guide or marking includes a guide notch disposed on an edge of the lead contact portion, the guide notch configured to guide a singulation tool to singulate the primary clip along a lateral line perpendicular to the edge.

16. The primary clip of claim 10 , further comprising, a pair of tie bars attached to edges of the aligner structure, the tie bars holding the primary clip between a pair of spaced-apart holed runner strips of a clip frame.

17. A clip frame comprising:

a pair of spaced-apart holed runner strips, and

a clip held by tie bars between the pair of spaced-apart holed runner strips, the clip including:

an aligner structure configured to attach a lead contact portion to a lead post;

a die contact portion configured to contact a surface of a semiconductor die,

the die contact portion having a surface downset from a surface of the lead contact portion, the die contact portion having a first lateral width; and

an intermediate portion connecting the die contact portion to the lead contact portion in the aligner structure,

the clip including at least a secondary clip formed by removal of a part of the die contact portion, a remaining die contact portion remaining in the secondary clip having a second lateral width that is smaller than the first lateral width.

18. A method comprising:

receiving a semiconductor die;

receiving a leadframe including a lead post;

receiving a clip frame holding a primary clip by tie bars attached to the primary clip, the primary clip including an aligner structure configured to attach the primary clip to the lead post and a flat die contact portion coupled to the clip aligner structure, the flat die contact portion having a first width, the primary clip being severable into at least a secondary clip, the secondary clip including a part of flat die contact portion having a second width;

determining a width of a contact pad on the semiconductor die;

when the width of the contact pad matches the first width of the flat die contact portion of the primary clip, extracting the primary clip from the clip frame and attaching the primary clip to the contact pad on the semiconductor die; and

when the width of the contact pad matches the second width of the part of flat die contact portion in the secondary clip, extracting the secondary clip from the clip frame and attaching the secondary clip to the contact pad on the semiconductor die.

19. The method of claim 18 , wherein extracting the secondary clip from the clip frame includes singulating the primary clip to remove a section of the flat die contact portion in primary clip while keeping the part of flat die contact portion having a second width in the secondary clip.

20. The method of claim 18 , wherein extracting the primary clip and the secondary clip from the clip frame includes singulating the tie bars holding the primary clip in the clip frame.

21. The method of claim 18 , wherein attaching the primary clip to the semiconductor die and attaching the secondary clip to the semiconductor die include attaching the clip aligner structure to the lead post.

22. The method of claim 18 , wherein the contact pad on the semiconductor die is a source contact pad of a device in the semiconductor die.