Patent Application
Provisional
App. No. 63/362,638
· Confirmation No. 8725
TRANSFER MOLDED POWER MODULE
Inventors:
Seungwon IM, Oseob JEON, Dongwook KANG, Youngsun KO, Jeungdae KIM, Changsun YUN, Jihwan KIM
Applicant:
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2022-04-19 | APP.FILE.REC |
Filing Receipt | 3 | View | |
| 2022-04-07 | ADS |
Application Data Sheet | 10 | View | |
| 2022-04-07 | N417.PYMT |
Electronic Fee Payment | 2 | View | |
| 2022-04-07 | SPEC |
Specification | 9 | View | |
| 2022-04-07 | CLM |
Claims | 1 | View | |
| 2022-04-07 | N417 |
Electronic Filing System Acknowledgment Receipt | 3 | View | |
| 2022-04-07 | SPEC |
Specification | 9 | View | |
| 2022-04-07 | CLM |
Claims | 1 | View | |
| 2022-04-07 | SPEC |
Specification | — | View |
Inventors
Seungwon IM
Seoul, KOREA, REPUBLIC OF
Oseob JEON
Seoul, KOREA, REPUBLIC OF
Dongwook KANG
Bucheon, KOREA, REPUBLIC OF
Youngsun KO
Incheon, KOREA, REPUBLIC OF
Jeungdae KIM
Gimpo, KOREA, REPUBLIC OF
Changsun YUN
Seoul, KOREA, REPUBLIC OF
Jihwan KIM
Seoul, KOREA, REPUBLIC OF
Attorneys & Agents of Record
Prosecution
- Customer No.
- 64296
- Docket No.
- ONS04642L01US
- Confirmation No.
- 8725
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, AS GRANTOR,
ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC., AS GRANTOR
RELEASE OF SECURITY INTEREST IN PATENTS, RECORDED AT REEL 061071, FRAME 052
Recorded 2023-06-22
SECURITY INTEREST
Recorded 2022-08-04
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Quick Facts
- App. No.
- 63/362,638
- Filed
- 2022-04-07
External Links