Power module
A method includes attaching a power electronic substrate to a bottom of a frame. The frame has a box-like rectangular shape with an open top and an open bottom. The method further includes disposing an external conductive terminal on the frame. The external conductive terminal has at least one terminal stub that extends on to the front surface of the power electronic substrate. The method further includes welding the at least one terminal stub to at least one circuit trace disposed on the front surface of the power electronic substrate.
1 . A power module, comprising:
a frame having a base and at least one sidewall extending from the base of the frame and defining a cavity;
a power electronic substrate attached to the base of the frame, a circuit trace and a die disposed on a front surface of the power electronic substrate within the cavity of the frame, the die including a device junction, a bottom surface of the power electronic substrate being exposed through an opening in the base of the frame;
at least one signal pin directly attached to a connection point on the front surface of the power electronic substrate;
an external conductive terminal disposed on a top surface of a sidewall of the frame; and
a conductive base plate thermally coupled to the bottom surface of the power electronic substrate exposed through the opening in the base of the frame, the conductive base plate absorbing at least some of a thermal load at the connection point and reducing a device junction-to-connection point thermal resistance of the power module.
2 . The power module of claim 1 , further comprising:
a cover plate disposed on a top of the frame.
3 . The power module of claim 2 , wherein the at least one signal pin and the external conductive terminal extend through a respective hole in the cover plate to an outside of the power module.
4 . The power module of claim 1 , wherein the frame is made of plastic, polymeric or ceramic materials.
5 . The power module of claim 1 , wherein the frame is made of polybutylene terephthalate (PBT).
6 . The power module of claim 1 , wherein the frame has a rectangular base length L in a range of about 50 mm to 150 mm, a rectangular base width W in a range of about 30 mm to 80 mm, and four sidewalls, each of the four sidewalls having a height H in a range of 5 mm to 20 mm.
7 . The power module of claim 1 , wherein the conductive base plate is a solid block of metal or metal alloy and has a thickness in a range of about 2 mm to 10 mm.
8 . The power module of claim 1 , wherein the conductive base plate is directly attached to the bottom surface of the power electronic substrate.
9 . The power module of claim 1 , wherein the conductive base plate is soldered to the bottom surface of the power electronic substrate.
10 . A power module, comprising:
a frame having a box-like rectangular shape made of a base and a sidewall extending from the base and defining a cavity; and
a power electronic substrate directly attached to the base of the frame with a front surface of the power electronic substrate being exposed to the cavity and at least one circuit trace disposed on the front surface of the power electronic substrate, the power electronic substrate including a device junction, wherein a bottom surface of the power electronic substrate is exposed through an opening in the base of the frame.
11 . The power module of claim 10 , further comprising an external conductive terminal disposed on a top surface of the sidewall of the frame, the external conductive terminal connected to at least a terminal stub that extends on to and is connected directly to the at least one circuit trace on the front surface of the power electronic substrate, wherein the external conductive terminal is made of a metal or a metal alloy.
12 . The power module of claim 11 , wherein the terminal stub is welded at a weld point to the at least one circuit trace so that at least some current from the power electronic substrate is carried to an exterior of the power module through the external conductive terminal.
13 . The power module of claim 10 , further comprising:
at least one signal pin attached by a solder at a solder point to the front surface of the power electronic substrate.
14 . The power module of claim 13 , further comprising:
a conductive base plate thermally coupled to the bottom surface of the power electronic substrate exposed through the opening in the frame, the conductive base plate absorbing at least some of a thermal load on the solder at the solder point to reduce a device junction-to-solder-point thermal resistance of the power module.
15 . The power module of claim 10 , further comprising:
at least one signal pin that is at least partially embedded in a sidewall of the frame and wire bonded to a trace or device disposed on the front surface of the power electronic substrate.
16 . A power module, comprising:
a frame having a base and four sidewalls extending from the base and defining a cavity;
a power electronic substrate attached to the base of the frame, the power electronic substrate having a front surface exposed within the cavity with at least one circuit trace disposed on the front surface of the power electronic substrate, junction wherein a bottom surface of the power electronic substrate is exposed through an opening in the base of the frame;
an external conductive terminal having a horizontal orientation disposed on a top surface of a sidewall of the frame; and
at least one signal pin that is at least partially embedded in one of the four sidewalls of the frame and wire bonded to a trace or device disposed on the front surface of the power electronic substrate.
17 . The power module of claim 16 , wherein the at least one signal pin that is at least partially embedded in one of the four sidewalls of the frame has a bottom portion that is exposed to an interior of the power module.
18 . The power module of claim 16 , wherein the at least one signal pin that is at least partially embedded one of the four sidewalls of the frame has a bottom portion that is shaped as a wire-bondable tab.
19 . The power module of claim 16 , further comprising:
at least one other signal pin attached by a solder at a solder point to the front surface of the power electronic substrate.
20 . The power module of claim 19 , further comprising:
a conductive base plate thermally coupled to the bottom surface of the power electronic substrate exposed through the opening in the frame, the conductive base plate absorbing at least some of a thermal load on the solder at the solder point to reduce a device junction-to-solder-point thermal resistance of the power module.
21 . The power module of claim 16 , wherein the external conductive terminal is connected to at least a terminal stub that extends on to and is directly connected to a circuit trace disposed on the front surface of the power electronic substrate.
22 . A method, comprising:
attaching a power electronic substrate to a base of a frame in a power module, the frame having at least one sidewall extending from the base of the frame, at least one circuit trace disposed on a front surface of the power electronic substrate, the power electronic substrate including a device junction, wherein a bottom surface of the power electronic substrate is exposed through an opening in the base of the frame;
disposing an external conductive terminal disposed on a top of the at least one sidewall the frame, the external conductive terminal connected to at least one terminal stub that extends on to the front surface of the power electronic substrate; and
connecting the at least one terminal stub directly on to the at least one circuit trace disposed on the front surface of the power electronic substrate.
23 . The method of claim 22 , wherein the at least one sidewall of the frame includes a partially embedded signal pin, a bottom portion of the partially embedded signal pin being exposed to an interior of the frame,
the method further comprises:
wire bonding the bottom portion of the partially embedded signal pin to the at least one circuit trace.
24 . The method of claim 22 , further comprising:
attaching at least one signal pin with solder at a connection point on the front surface of the power electronic substrate; and
soldering a base plate to a bottom surface of the power electronic substrate the base plate absorbing at least some of a thermal load on the solder at the connection point to reduce a device junction-to-connection-point thermal resistance in the power module.