Patent Assignment
Reel/Frame 059667/0625
Assignment of Assignor's Interest
Recorded: 2022-04-21
Pages: 7
Assignors
CHO, SUNGWON
Executed: 2019-08-02
KIM, CHANGOH
Executed: 2019-08-02
SHIM, IL KWON
Executed: 2020-06-26
YOON, INSANG
Executed: 2019-08-23
PARK, KYOUNGHEE
Executed: 2019-08-20
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
EMI Shielding for Flip Chip Package with Exposed Die Backside
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.