Patent Assignment
Reel/Frame 059698/0052
Assignment of Assignor's Interest
Recorded: 2022-04-25
Pages: 7
Assignors
LEE, HYOUNGSOON
Executed: 2022-04-25
IN, JUNG BIN
Executed: 2022-04-25
KIM, YUNSEO
Executed: 2022-04-25
KONG, DAEYOUNG
Executed: 2022-04-25
KIM, KIWAN
Executed: 2022-04-25
LEE, JUNGBAE
Executed: 2022-04-25
Assignee
CHUNG ANG UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION
84, HEUKSEOK-RO, DONGJAK-GU, SEOUL, 06974, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packaging
Application:
17/660,485 →
Publication:
US 2022/0415751