Patent Assignment
Reel/Frame 059716/0625
Assignment of Assignor's Interest
Recorded: 2022-04-29
Pages: 7
Assignors
PARK, JUMYONG
Executed: 2022-03-18
KANG, UNBYOUNG
Executed: 2022-03-18
KIM, BYEONGCHAN
Executed: 2022-03-18
SONG, SOLJI
Executed: 2022-03-18
LEE, CHUNGSUN
Executed: 2022-03-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device, Semiconductor Package and Method of Manufacturing the Same