Patent Assignment
Reel/Frame 059760/0823
Assignment of Assignor's Interest
Recorded: 2022-04-28
Pages: 6
Assignors
HONG, MYEONGHO
Executed: 2022-02-24
KIM, DOWON
Executed: 2022-02-04
SON, JANGBAE
Executed: 2022-02-04
YOON, SEOKWOO
Executed: 2022-02-04
LIM, KYOMUK
Executed: 2022-02-07
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Core Substrate, Package Structure Including the Core Substrate, and Method of Manufacturing Semiconductor Package