Patent Assignment
Reel/Frame 059769/0347
Assignment of Assignor's Interest
Recorded: 2022-04-29
Pages: 5
Assignors
LU, YEN-SHENG
Executed: 2022-04-27
WEN, CHUNG-CHI
Executed: 2022-04-19
CHEN, YEN-TING
Executed: 2022-04-17
LEE, WEI-YANG
Executed: 2022-04-17
LIN, CHIA-PIN
Executed: 2022-04-17
CHANG, CHIH-CHIANG
Executed: 2022-04-17
KUO, CHIEN-I
Executed: 2022-04-19
PENG, YUAN-CHING
Executed: 2022-04-17
WANG, CHIH-CHING
Executed: 2022-04-19
HSIEH, WEN-HSING
Executed: 2022-04-17
LI, CHII-HORNG
Executed: 2022-04-24
YEO, YEE-CHIA
Executed: 2022-04-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Methods for Fabricating Semiconductor Device Having Nanostructure Transistor with Cap Layer
Application:
17/732,552 →
Publication:
US 2023/0352594