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Patent Assignment
Reel/Frame 059794/0659

Assignment of Assignor's Interest

Recorded: 2022-05-03 Pages: 6
Assignors
LEE, CHANMI
Executed: 2022-04-08
PARK, SANGWUK
Executed: 2022-04-08
SEO, YEJEONG
Executed: 2022-04-12
CHUNG, SANGGYO
Executed: 2022-04-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Memory Device and Method of Fabricating the Same
Application: 17/735,306 →
Publication: US 2023/0084694