Patent Assignment
Reel/Frame 059795/0608
Assignment of Assignor's Interest
Recorded: 2022-04-26
Pages: 8
Assignors
YANG, JULIE
Executed: 2019-10-15
WU, CHII-MING
Executed: 2019-11-17
TSAI, TZU-CHUNG
Executed: 2019-10-16
CHANG, YAO-WEN
Executed: 2019-10-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Film Structure for Bond Pad