Film structure for bond pad
The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes an interconnect structure disposed over a substrate. The interconnect structure includes a plurality of interconnect layers disposed within a dielectric structure. A bond pad structure is disposed over the interconnect structure. The bond pad structure includes a contact layer. A first masking layer including a metal-oxide is disposed over the bond pad structure. The first masking layer has interior sidewalls arranged directly over the bond pad structure to define an opening. A conductive bump is arranged within the opening and on the contact layer.
1. An integrated chip, comprising:
an interconnect structure disposed over a substrate, wherein the interconnect structure comprises a plurality of interconnect layers disposed within a dielectric structure;
a bond pad structure disposed over the interconnect structure, wherein the bond pad structure comprises a contact layer;
a first masking layer comprising a metal-oxide disposed over the bond pad structure, the first masking layer having interior sidewalls and having a bottommost surface arranged directly over a top surface of the bond pad structure, the interior sidewalls forming an opening extending through the first masking layer;
a second masking layer disposed over the first masking layer and along sidewalls of the bond pad structure, wherein the second masking layer vertically extends below the bottommost surface of the first masking layer; and
a conductive bump arranged within the opening and on the contact layer.
2. The integrated chip of claim 1 , wherein an entirety of the bottommost surface of the first masking layer is directly over the top surface of the bond pad structure.
3. The integrated chip of claim 1 , wherein the first masking layer comprises aluminum-oxide or magnesium-oxide.
4. The integrated chip of claim 3 ,
wherein the second masking layer has interior sidewalls arranged directly over the bond pad structure to further define the opening.
5. The integrated chip of claim 1 , wherein the bond pad structure comprises a titanium nitride vertically sandwiched between layers of titanium, the contact layer being titanium.
6. The integrated chip of claim 5 , wherein the titanium nitride physically contacts the layers of titanium.
7. The integrated chip of claim 1 , wherein the bond pad structure further comprises:
a lower titanium layer; and
a titanium nitride layer contacting an upper surface of the lower titanium layer; and
an upper titanium layer contacting an upper surface of the titanium nitride layer, wherein an upper surface of the upper titanium layer physically contacts a lower surface of the first masking layer.
8. The integrated chip of claim 1 , wherein the contact layer comprises titanium and the first masking layer comprises aluminum oxide, the aluminum oxide physically contacting the titanium.
9. An integrated chip, comprising:
a plurality of interconnects disposed within a dielectric structure over a substrate;
a bond pad structure disposed over an upper surface of the dielectric structure and electrically coupled to the plurality of interconnects, wherein the bond pad structure comprises a metal contact layer;
a first metal-oxide masking layer contacting the metal contact layer, the first metal-oxide masking layer having interior sidewalls arranged directly over the metal contact layer;
a conductive bonding structure disposed directly between the interior sidewalls of the first metal-oxide masking layer and on the metal contact layer; and
a second metal-oxide masking layer disposed over the first metal-oxide masking layer and completely covering outermost sidewalls of the bond pad structure, outermost sidewalls of the dielectric structure, and outermost sidewalls of the substrate.
10. The integrated chip of claim 9 , wherein the metal contact layer is titanium, chromium, platinum, or gold.
11. The integrated chip of claim 9 , further comprising:
a titanium nitride layer contacting a bottom of the metal contact layer, wherein the metal contact layer is titanium; and
a titanium layer contacting a bottom of the titanium nitride layer.
12. The integrated chip of claim 9 , wherein opposing outermost sidewalls of the first metal-oxide masking layer are entirely vertically above a topmost surface of the bond pad structure.
13. The integrated chip of claim 12 , wherein the second metal-oxide masking layer laterally extends past the outermost sidewalls of the first metal-oxide masking layer and vertically extends past a bottommost surface of the first metal-oxide masking layer.
14. The integrated chip of claim 9 , wherein a bottommost surface of the first metal-oxide masking layer is over a topmost surface of the metal contact layer.
15. The integrated chip of claim 9 , wherein the second metal-oxide masking layer vertically separates an upper surface of the first metal-oxide masking layer from a lower surface of the conductive bonding structure.
16. An integrated chip, comprising:
a plurality of interconnects disposed within a dielectric structure over a substrate;
a bond pad structure disposed over the dielectric structure and comprising a contact layer, the bond pad structure being electrically coupled to the plurality of interconnects;
a first metal-oxide masking layer, wherein an entirety of the first metal-oxide masking layer is laterally between opposing outermost sidewalls of the bond pad structure and directly over an upper surface of the contact layer facing away from the substrate;
a second metal-oxide masking layer disposed over the first metal-oxide masking layer, wherein the second metal-oxide masking layer continuously extends from vertically above a topmost surface of the first metal-oxide masking layer to vertically below a bottommost surface of the first metal-oxide masking layer; and
a bonding structure arranged over the first metal-oxide masking layer, wherein the bonding structure extends through the first metal-oxide masking layer to the contact layer.
17. The integrated chip of claim 16 , wherein the
second metal-oxide masking layer is laterally separated from the plurality of interconnects by the dielectric structure.
18. The integrated chip of claim 17 , wherein a sidewall of the bonding structure contacts interior sidewalls of both the first metal-oxide masking layer and the second metal-oxide masking layer.
19. The integrated chip of claim 16 , wherein the contact layer is titanium and the first metal-oxide masking layer is aluminum-oxide.
20. The integrated chip of claim 16 ,
wherein the second metal-oxide masking layer has a horizontally extending segment disposed over the first metal-oxide masking layer and a vertically extending segment protruding outward from a bottom of the horizontally extending segment to below the first metal-oxide masking layer.