Mounting substrate
A mounting substrate includes a substrate, a bonding pad and an induction heating pad. The bonding pad is formed on the substrate, and adhered to a solder ball to mount a semiconductor chip on the substrate. The induction heating pad is disposed adjacent to the bonding pad, the induction heating pad being induction heated by an applied alternating magnetic field to reflow the solder ball. The induction heating pad having a diameter greater than a skin depth in response to the frequency of the applied alternating magnetic field is selectively induction heated in response to a low frequency band of the alternating magnetic field. Accordingly, during a reflow process for a solder ball, the semiconductor chip may be mounted on the mounting substrate to complete a semiconductor package without damaging the mounting substrate, to thereby improve the reliability of the completed semiconductor package.
1. A mounting substrate, comprising:
a substrate;
a bonding pad formed on the substrate and adhered to a solder ball to mount a semiconductor chip on the substrate; and
an induction heating pad adjacent to the bonding pad, the induction heating pad being induction heated by an applied alternating magnetic field to reflow the solder ball, the induction heating pad corresponding to the bonding pad in a one-to-one relation, and the induction heating pad directly contacting the bonding pad.
2. The mounting substrate of claim 1 , wherein the induction heating pad comprises a diameter greater than a skin depth determined by the frequency of the applied alternating magnetic field.
3. The mounting substrate of claim 2 , wherein the thickness of the induction heating pad is less than the skin depth.
4. The mounting substrate of claim 1 , wherein the induction heating pad comprises copper.
5. The mounting substrate of claim 1 , wherein the frequency of the applied alternating magnetic field ranges from about 10 kHz to about 100 kHz.
6. The mounting substrate of claim 5 , wherein the diameter of the induction heating pad ranges from about 700 μm to about 210 μm.
7. The mounting substrate of claim 1 , wherein the induction heating pad surrounds the bonding pad.
8. The mounting substrate of claim 1 , further comprising:
a solder mask formed on the bonding pad to expose a portion of the bonding pad.
9. The mounting substrate of claim 1 , further comprising:
a solder mask spaced apart from the bonding pad.
10. The mounting substrate of claim 9 , further comprising:
an adhesion preventing pattern formed in a peripheral region of the bonding pad to prevent the solder ball from making contact with the solder mask after reflowing.
11. A mounting substrate, comprising:
a substrate; and
a solder ball adhering member formed on the substrate to adhere to a solder ball to mount a semiconductor chip on the substrate, the solder ball adhering member including an induction heating region capable of being induction heated by an applied alternating magnetic field to reflow the solder ball, the induction heating region corresponding to the solder ball adhering member in a one-to-one relation, and the induction heating pad directly contacting the bonding pad.
12. The mounting substrate of claim 11 , wherein the induction heating region includes a different material than the remaining portions of the solder ball adhering member.
13. The mounting substrate of claim 12 , wherein the induction heating region includes a highly conductive material while the remaining portions of the solder ball adhering member is not highly conductive.
14. The mounting substrate of claim 12 , wherein the induction heating region of the solder ball adhering member is disposed below the remaining portions thereof and has a larger diameter than a diameter of the remaining portions thereof.
15. The mounting substrate of claim 12 , wherein the induction heating region of the solder ball adhering member has a thickness less than a skin depth caused by a frequency of an applied alternating magnetic field.
16. The mounting substrate of claim 12 , wherein the induction heating region of the solder ball adhering member has a diameter greater than a skin depth caused by a frequency of an applied alternating magnetic field.
17. A mounting substrate, comprising:
a substrate;
bonding pads formed on the substrate and adhered to respective solder balls to mount at least one semiconductor chip on the substrate; and
induction heating pads respectively adjacent to the bonding pads, the induction heating pads being induction heated by an applied alternating magnetic field to reflow the solder balls, and the induction heating pads corresponding to the bonding pads in a one-to-one relation, and the induction heating pad directly contacting the bonding pad.