Patent Assignment
Reel/Frame 059827/0725
Assignment of Assignor's Interest
Recorded: 2022-05-05
Pages: 3
Assignors
CHEN, WEI-YU
Executed: 2022-05-02
FLESHMAN, COLLIN JORDON
Executed: 2022-05-05
LEE, CHIEN-HSUN
Executed: 2022-05-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6 ROAD, HSINCHU SCIENCE PARK, HSINCHU, ROC 30077, TAIWAN
Covered Property
(1)
Package Structure Including an Array of Copper Pillars and Methods of Forming the Same