Patent Assignment
Reel/Frame 059837/0888
Assignment of Assignor's Interest
Recorded: 2022-05-06
Pages: 7
Assignors
PARK, TAE JIN
Executed: 2022-02-24
GO, GYUL
Executed: 2022-03-07
KIM, JUN SOO
Executed: 2022-02-17
YOON, GYUNG HYUN
Executed: 2022-02-24
CHA, EUI JUN
Executed: 2022-03-02
KIM, HUI-JUNG
Executed: 2022-03-02
HWANG, YOO SANG
Executed: 2022-04-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Element Isolation Film and Method for Fabricating the Same