Patent Assignment
Reel/Frame 059838/0788
Assignment of Assignor's Interest
Recorded: 2022-05-06
Pages: 4
Assignors
WANG, WEI-CHENG
Executed: 2022-03-08
CHIU, SHIH-HANG
Executed: 2022-03-08
LIU, KUAN-TING
Executed: 2022-03-08
CHUI, CHI ON
Executed: 2022-03-08
CHEN, CHIA-WEI
Executed: 2022-03-08
CHEN, JIAN-HAO
Executed: 2022-03-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Metal Capping Layer for Reducing Gate Resistance in Semiconductor Devices
Application:
17/738,238 →
Publication:
US 2023/0016381