Patent Assignment
Reel/Frame 059866/0032
Assignment of Assignor's Interest
Recorded: 2022-05-08
Pages: 8
Assignors
YANG, CHIN-CHIA
Executed: 2022-04-26
LIN, DA-JUN
Executed: 2022-04-26
TSAI, FU-YU
Executed: 2022-04-26
TSAI, BIN-SIANG
Executed: 2022-04-26
Assignee
UNITED MICROELECTRONICS CORP.
NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK,, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Structure and Manufacturing Method Thereof
Application:
17/735,126 →
Publication:
US 2023/0361067