Patent Assignment
Reel/Frame 059867/0818
Assignment of Assignor's Interest
Recorded: 2022-05-09
Pages: 3
Assignors
LEE, YI-JYUN
Executed: 2022-04-12
HO, DUEN-YI
Executed: 2022-04-12
LIU, HSING-CHIH
Executed: 2022-04-12
KUO, CHE-HUNG
Executed: 2022-04-12
Assignee
MEDIATEK INC.
NO. 1, DUSING 1ST RD., HSINCHU SCIENCE PARK, HSINCHU CITY, 30078, TAIWAN
Covered Property
(1)
Semiconductor Package Structure