Patent Assignment
Reel/Frame 059869/0456
Assignment of Assignor's Interest
Recorded: 2022-05-09
Pages: 5
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Making the Same
Application:
17/709,045 →
Publication:
US 2023/0276714