Patent Assignment
Reel/Frame 059890/0284
Assignment of Assignor's Interest
Recorded: 2022-05-11
Pages: 3
Assignors
CHEN, XIANMING
Executed: 2022-05-09
FENG, LEI
Executed: 2022-05-06
HUANG, BENXIA
Executed: 2022-05-06
HONG, YEJIE
Executed: 2022-05-06
Assignee
ZHUHAI ACCESS SEMICONDUCTOR CO., LTD
FPC FACTORY, 3209 NORTH ZHUFENG AVENUE, DOUMEN, ZHUHAI,, GUANGDONG, 519175, CHINA
Covered Property
(1)
Multi-Device Graded Embedding Package Substrate and Manufacturing Method Thereof