Patent Assignment
Reel/Frame 059890/0762
Assignment of Assignor's Interest
Recorded: 2022-05-11
Pages: 3
Assignors
SADHU, BODHISATWA
Executed: 2022-05-11
YECK, MARK
Executed: 2022-05-11
PAIDIMARRI, ARUN
Executed: 2022-05-11
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Symmetric Multi-Ic Modules Using Hierarchical Digital Reconfiguration of Integrated Circuit Chips
Application:
17/741,677 →
Publication:
US 2023/0369743