Patent Assignment
Reel/Frame 059900/0829
Assignment of Assignor's Interest
Recorded: 2022-05-13
Pages: 5
Assignors
LEE, HAEMIN
Executed: 2022-04-14
KIM, BYOUNG-TAEK
Executed: 2022-04-14
SONG, HYEONJOO
Executed: 2022-04-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Semiconductor Memory Device Including Separation Structures and Sacrificial Layers and Electronic System Including the Same