Patent Assignment
Reel/Frame 059901/0546
Assignment of Assignor's Interest
Recorded: 2022-05-13
Pages: 7
Assignor
SAKAGUCHI, YUTA
Executed: 2022-04-19
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI,, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Interconnect Substrate and Method of Making Interconnect Substrate