Patent Assignment
Reel/Frame 059918/0655
Assignment of Assignor's Interest
Recorded: 2022-05-16
Pages: 4
Assignors
SUN, CHIH-HUNG
Executed: 2022-05-09
CHENG, PO-HSIEN
Executed: 2022-05-02
WU, ZHEN-CHENG
Executed: 2022-05-02
CHUI, CHI-ON
Executed: 2022-05-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Manufacturing Semiconductor Devices Including Forming an Air Gap Based on Removing a Recessed Sacrificial Layer