Patent Assignment
Reel/Frame 059919/0436
Assignment of Assignor's Interest
Recorded: 2022-05-16
Pages: 3
Assignors
YEH, YU-CHENG
Executed: 2017-07-10
WANG, YEN-SEN
Executed: 2017-07-17
LIN, MING-YI
Executed: 2017-07-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Layouts with Fill Feature Shapes