Patent Assignment
Reel/Frame 059927/0547
Assignment of Assignor's Interest
Recorded: 2022-05-17
Pages: 5
Assignors
HUANG, HSIN-YEN
Executed: 2019-09-06
LEE, SHAO-KUAN
Executed: 2019-09-06
LEE, CHENG-CHIN
Executed: 2019-09-06
CHEN, HAI-CHING
Executed: 2019-09-06
SHUE, SHAU-LIN
Executed: 2019-09-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Selective Deposition for Integrated Circuit Interconnect Structures