Patent Assignment
Reel/Frame 059933/0009
Assignment of Assignor's Interest
Recorded: 2022-05-17
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO.8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Manufacturing Semiconductor Devices Including a Cap Insulating Layer
Application:
17/746,323 →
Publication:
US 2023/0223253