Patent Assignment
Reel/Frame 059945/0098
Assignment of Assignor's Interest
Recorded: 2022-05-18
Pages: 7
Assignors
KIM, KYUNGKYU
Executed: 2022-05-10
KIM, WOONBAE
Executed: 2022-05-10
LEE, DAEHO
Executed: 2022-05-10
LEE, JUNGPIL
Executed: 2022-05-10
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Stack Structure of Logic Chip and Sensing Chips