Patent Assignment
Reel/Frame 059953/0130
Assignment of Assignor's Interest
Recorded: 2022-05-11
Pages: 5
Assignors
SHIN, SEUNGWAN
Executed: 2022-03-21
KANG, JUNGHOON
Executed: 2022-03-21
LEE, GUN
Executed: 2022-03-21
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including an Encapsulant