Patent Assignment
Reel/Frame 059961/0681
Assignment of Assignor's Interest
Recorded: 2022-05-19
Pages: 3
Assignor
HSU, SHOU-CHIAN
Executed: 2022-05-09
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Image Sensor Packaging Structures and Related Methods
Application:
17/664,138 →
Publication:
US 2023/0395633
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 4, 2022
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 061071/0525 →
Release of Security Interest in Patents, Recorded at Reel 061071, Frame 052
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, AS GRANTOR; ON SEMICONDUCTOR CONNECTIVITY SOLUTIONS, INC., AS GRANTOR
Reel/Frame 064067/0654 →