Patent Assignment
Reel/Frame 059961/0883
Assignment of Assignor's Interest
Recorded: 2022-05-19
Pages: 4
Assignors
WU, I-WEN
Executed: 2022-03-01
HUANG, PO-YU
Executed: 2022-03-01
LEE, CHEN-MING
Executed: 2022-03-01
YANG, FU-KAI
Executed: 2022-03-07
WANG, MEI-YUN
Executed: 2022-03-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Isolation Structure And A Self-Aligned Capping Layer Formed Thereon