Patent Assignment
Reel/Frame 059963/0676
Assignment of Assignor's Interest
Recorded: 2022-05-19
Pages: 3
Assignors
YU, TZU-WEI
Executed: 2022-05-09
WANG, CHING-HUNG
Executed: 2022-05-18
LIN, YEONG-JYH
Executed: 2022-05-09
LI, CHING I
Executed: 2022-05-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Bonding Tool and Method of Operating the Same
Application:
17/664,162 →
Publication:
US 2023/0378125